AT352870T
Semiconductor chip assemblies, methods of making same and components for same
Abstract
This record has no abstract on file.
Term
Term ended
Expired 24 September 2011, 15 years ago.
- Priority
- Filed
- Granted
- Expired
- Today
62 members in 11 offices
Priority claims8
| Document | Office | Kind | Date |
|---|---|---|---|
| 58675890 | United States of America | A | |
| 58675890 | United States of America | A | |
| 67302091 | United States of America | A | |
| 67302091 | United States of America | A | |
| 586758 | – | – | – |
| 673020 | – | – | – |
| US19900586758 | – | – | – |
| US19910673020 | – | – | – |
Members62
| Document | Office | Kind | |
|---|---|---|---|
| CA2091438A1 | Canada | A1 | |
| WO9205582A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU8731291A | Australia | A | |
| US5148265A | United States of America | A | |
| US5148266A | United States of America | A | |
| EP0551382A1 | European Patent Office (EPO) | A1 | |
| EP0551382A4 | European Patent Office (EPO) | A4 | |
| US5258330A | United States of America | A | |
| JPH06504408A | Japan | A | |
| US5346861A | United States of America | A | |
| US5347159A | United States of America | A | |
| KR970005709B1 | Republic of Korea | B1 | |
| US5679977A | United States of America | A | |
| US5682061A | United States of America | A | |
| US5685885A | United States of America | A | |
| US5848467A | United States of America | A | |
| US5852326A | United States of America | A | |
| JP2924923B2 | Japan | B2 | |
| US5950304A | United States of America | A | |
| CA2091438C | Canada | C | |
| US6133627A | United States of America | A | |
| EP1111672A2 | European Patent Office (EPO) | A2 | |
| US2001030370A1 | United States of America | A1 | |
| EP0551382B1 | European Patent Office (EPO) | B1 | |
| AT211305T | Austria | T | |
| ATE211305T1 | Austria | T1 | |
| DE69132880D1 | Germany | D1 | |
| US2002011663A1 | United States of America | A1 | |
| DK0551382T3 | Denmark | T3 | |
| US6372527B1 | United States of America | B1 | |
| ES2167313T3 | Spain | T3 | |
| US6392306B1 | United States of America | B1 | |
| US6433419B2 | United States of America | B2 | |
| DE69132880T2 | Germany | T2 | |
| EP1111672A3 | European Patent Office (EPO) | A3 | |
| US6465893B1 | United States of America | B1 | |
| US2002155728A1 | United States of America | A1 | |
| US2003168253A1 | United States of America | A1 | |
| EP1353374A1 | European Patent Office (EPO) | A1 | |
| US2005087855A1 | United States of America | A1 | |
| EP1111672B1 | European Patent Office (EPO) | B1 | |
| AT297054T | Austria | T | |
| ATE297054T2 | Austria | T2 | |
| DE69133468D1 | Germany | D1 | |
| US2005218495A1 | United States of America | A1 | |
| DE69133468T2 | Germany | T2 | |
| ES2242704T3 | Spain | T3 | |
| US7098078B2 | United States of America | B2 | |
| US2006244135A1 | United States of America | A1 | |
| EP1353374B1 | European Patent Office (EPO) | B1 | |
| AT352870TThis record | Austria | T | |
| ATE352870T1 | Austria | T1 | |
| DE69133558D1 | Germany | D1 | |
| US7198969B1 | United States of America | B1 | |
| DK1353374T3 | Denmark | T3 | |
| US7271481B2 | United States of America | B2 | |
| ES2281598T3 | Spain | T3 | |
| US7291910B2 | United States of America | B2 | |
| DE69133558T2 | Germany | T2 | |
| EP1111672B2 | European Patent Office (EPO) | B2 | |
| DE69133468T3 | Germany | T3 | |
| ES2242704T5 | Spain | T5 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Publication, DOCDB
- 352870
- Publication, EPODOC
- AT352870T
- Application
- 3076966
- Application, DOCDB
- 03076966
- Application, EPODOC
- AT20030076966T
Titles2
- German
- HALBLEITERCHIPANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG
- English
- SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF
Classification
- CPC, 51
- H01L21/6836
- H01L21/822
- H01L22/32
- H01L23/13
- H01L23/3107
- H01L23/3164
- H01L23/49805
- H01L23/49827
- H01L23/49838
- H01L23/4985
- H01L23/49861
- H01L24/81
- H01L25/16
- H01L25/50
- H01L2221/68327
- H01L2224/16145
- H01L2224/274
- H01L2224/48091
- H01L2224/81801
- H01L2225/0651
- H01L2225/06517
- H01L2225/0652
- H01L2225/06579
- H01L2225/06596
- H01L2924/01029
- H01L2924/01033
- H01L2924/01078
- H01L2924/01079
- H01L2924/01082
- H01L2924/09701
- H01L2924/14
- H01L2924/30105
- H01L2924/30107
- H01L2924/3011
- H01L24/48
- H01L2924/01005
- H01L2924/01006
- H01L2924/01023
- H01L2924/01042
- H01L2924/01074
- H01L2924/014
- H01L24/27
- H01L24/50
- H05K2201/10378
- H01L2924/07811
- H01L2924/351
- H01L2924/00014
- H01L2924/12042
- H01L2224/4824
- H01L2924/181
- H01L24/86
- IPC, 9
- H01L21 60
- H01L21 822
- H01L21 98
- H01L23 13
- H01L23 31
- H01L23 485
- H01L23 498
- H01L23 58
- H01L25 16