Nova Patents
AT343316T

Board-level emi shield with enhanced thermal dissipation

Abstract

And a at least power element (11) substrate with an (10); An and is wrapped at least one of scattered conductive coating device of power element according to the pattern is a substrate (14); Shielding (20) and a conductive layer (26) board layer electromagnetic interference; Of The Banji to SHIELDING cover (20) are holes (23), wherein a hole (23) corresponding to the conductive fastening device (14); patternAt least heat-conducting joint (TCI) material (40) is at least power element; And, conductive layer of plate layer SHIELDING cover (26) and at least one conductive fastening device (14) electric contact.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

28 members in 15 offices

This recordMember, by publication datePriority claim5 more offices are in the list below

Priority claims1

Priority claims
DocumentOfficeKindDate
12025102United States of AmericaA

Members28

Family members, oldest first
DocumentOfficeKind
US2003193794A1United States of AmericaA1
CA2481842A1CanadaA1
WO03088729A1World Intellectual Property Organization (WIPO)A1
AU2003213838A1AustraliaA1
US6744640B2United States of AmericaB2
NO20044695LNorwayL
KR20040099415ARepublic of KoreaA
MXPA04009895AMexicoA
EP1493314A1European Patent Office (EPO)A1
BR0309043ABrazilA
HK1068204AHong Kong, ChinaA
HK1068204A1Hong Kong, ChinaA1
CN1659942AChinaA
AU2003213838B2AustraliaB2
IL164453A0IsraelA0
IL164453D0IsraelD0
JP2006513556AJapanA
KR100590662B1Republic of KoreaB1
EP1493314B1European Patent Office (EPO)B1
AT343316TThis recordAustriaT
ATE343316T1AustriaT1
DE60309150D1GermanyD1
DE60309150T2GermanyT2
CN100438737CChinaC
IL164453AIsraelA
JP4317033B2JapanB2
CA2481842CCanadaC
NO336280B1NorwayB1