Contact-free or hybrid contact-contact-free smart card with enhanced strength of the electronic module
Abstract
A smart card, comprising by paper fibre material bracket (12) is a set of antenna (18), wherein the two support card body on each one side, and low temperature yield plastic material is made at least one, and an electronic module (26), wherein the is connected to the radiofrequency chip, a slanting connection the pressure plate is welded with a module is the rotation structure and two clamping bodies are formed a. A bracket with the fibre material is made comprises at least one opening (14,16), and a hierarchical process, wherein the plastic layer of card body (23,25) is connected to the opening water inlet and connected to a state fully, the opening formed between two card body and a welding point, and distance between the connection of the module.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
38 members in 21 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 0111918 | France | A | |
| 0202161 | France | A |
Members38
| Document | Office | Kind | |
|---|---|---|---|
| US2003052177A1 | United States of America | A1 | |
| FR2829856A1 | France | A1 | |
| FR2829857A1 | France | A1 | |
| CA2429435A1 | Canada | A1 | |
| WO03025850A1 | World Intellectual Property Organization (WIPO) | A1 | |
| NO20032102D0 | Norway | D0 | |
| ZA200303026B | South Africa | B | |
| NO20032102L | Norway | L | |
| BR0205985A | Brazil | A | |
| IL155882A0 | Israel | A0 | |
| IL155882D0 | Israel | D0 | |
| CN1476587A | China | A | |
| KR20040032087A | Republic of Korea | A | |
| MXPA03004197A | Mexico | A | |
| EP1425714A1 | European Patent Office (EPO) | A1 | |
| FR2829857B1 | France | B1 | |
| PL361780A1 | Poland | A1 | |
| TWI222601B | Taiwan Province of China | B | |
| HK1063232A | Hong Kong, China | A | |
| HK1063232A1 | Hong Kong, China | A1 | |
| NZ525890A | New Zealand | A | |
| JP2005503620A | Japan | A | |
| US6851618B2 | United States of America | B2 | |
| EP1425714B1 | European Patent Office (EPO) | B1 | |
| AT335253TThis record | Austria | T | |
| ATE335253T1 | Austria | T1 | |
| CN1273925C | China | C | |
| DE60213619D1 | Germany | D1 | |
| RU2295155C2 | Russian Federation | C2 | |
| IL155882A | Israel | A | |
| DE60213619T2 | Germany | T2 | |
| AU2002339052B2 | Australia | B2 | |
| PL200142B1 | Poland | B1 | |
| JP4249020B2 | Japan | B2 | |
| KR100927881B1 | Republic of Korea | B1 | |
| CA2429435C | Canada | C | |
| NO334926B1 | Norway | B1 | |
| BRPI0205985B1 | Brazil | B1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Publication of translation of european patent specificationUEP | UEP |
Numbers
- Application
- 2777434
Titles2
- German
- KONTAKTLOSE ODER KOMBINIERTE KONTAKTLOSE/KONTAKTBEHAFTETE CHIPKARTE MIT VERSTÄRKTER MONTAGE DES CHIPMODULS
- English
- CONTACTLESS OR COMBINED CONTACTLESS / CONTACTED CHIP CARD WITH REINFORCED MOUNTING OF CHIP MODULE
Classification
- CPC, 7
- G06K19/07728
- G06K19/077
- G06K19/07743
- G06K19/07745
- G06K19/07749
- G06K19/0775
- H01L2924/0002
- IPC, 3
- B42D15 10
- G06K19 07
- G06K19 077