In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing

(57) The career (70) for this 接 (ing) summary chemical machinery polish equipment to a scouring pad (30), and the polished surface 1st side, and holding a substrate (10), It has the motor which is connected to at least 1 side of a scouring pad (30) and a carrier head (70), and produces relative motion among both. The eddy current supervising system (40) is positioned so that alternating field may be generated near the substrate (10), and an optical supervising system (140), An optical beam is generated, the catoptric light of this optical beam from a substrate (10) is detected, and a controller (90) receives the signal from an eddy current supervising system (40) and an optical supervising system (140).