AT303657T

Wireless radio frequency testing method of integrated circuits and wafers

Abstract

Apparatus for testing an integrated wafer circuit comprising: a) a test circuit formed on the wafer with the integrated circuit comprising the test circuit: i) an oscillator circuit variable ring having an oscillator circuit based ring and a plurality of sub-circuits coupled to the base ring oscillator circuit; and, ii) a control circuit for coupling selectively subcircuits oscillator circuit based ring to change the frequency of oscillation of said variable ring oscillator circuit based on a selected sub-circuit; and, b) a unit independent testing of the wafer, the test unit connected wireless to the test circuit to transmit a signal to activate the test circuit, in which the test circuit, when activated by the unit being test, test runs an independent integrated at least one of the aforementioned subcircuits selected by the control circuit, being the result of that test represented by the change in the frequency of said variable ring oscillator circuit to circuit.

Term

No projected expiry on record.

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EP1282913A2European Patent Office (EPO)A2
US2003146771A1United States of AmericaA1
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US2004164760A1United States of AmericaA1
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AT303657TThis recordAustriaT
ATE303657T1AustriaT1
DE60113096D1GermanyD1
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