Wireless radio frequency testing method of integrated circuits and wafers
Abstract
Apparatus for testing an integrated wafer circuit comprising: a) a test circuit formed on the wafer with the integrated circuit comprising the test circuit: i) an oscillator circuit variable ring having an oscillator circuit based ring and a plurality of sub-circuits coupled to the base ring oscillator circuit; and, ii) a control circuit for coupling selectively subcircuits oscillator circuit based ring to change the frequency of oscillation of said variable ring oscillator circuit based on a selected sub-circuit; and, b) a unit independent testing of the wafer, the test unit connected wireless to the test circuit to transmit a signal to activate the test circuit, in which the test circuit, when activated by the unit being test, test runs an independent integrated at least one of the aforementioned subcircuits selected by the control circuit, being the result of that test represented by the change in the frequency of said variable ring oscillator circuit to circuit.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
22 members in 8 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 2308820 | Canada | A | |
| 0100688 | Canada | W |
Members22
| Document | Office | Kind | |
|---|---|---|---|
| CA2308820A1 | Canada | A1 | |
| CA2409435A1 | Canada | A1 | |
| WO0188976A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO0188976A3 | World Intellectual Property Organization (WIPO) | A3 | |
| WO0188976B1 | World Intellectual Property Organization (WIPO) | B1 | |
| EP1282913A2 | European Patent Office (EPO) | A2 | |
| US2003146771A1 | United States of America | A1 | |
| JP2003533882A | Japan | A | |
| US6759863B2 | United States of America | B2 | |
| US2004164760A1 | United States of America | A1 | |
| EP1282913B1 | European Patent Office (EPO) | B1 | |
| AT303657TThis record | Austria | T | |
| ATE303657T1 | Austria | T1 | |
| DE60113096D1 | Germany | D1 | |
| ES2248327T3 | Spain | T3 | |
| DE60113096T2 | Germany | T2 | |
| US7183788B2 | United States of America | B2 | |
| US2007162801A1 | United States of America | A1 | |
| CA2409435C | Canada | C | |
| US8028208B2 | United States of America | B2 | |
| JP2012023382A | Japan | A | |
| JP4869535B2 | Japan | B2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 1933500
Titles2
- German
- DRAHTLOSE HOCHFREQUENZPRÜFMETHODE FÜR INTEGRIERTE SCHALTUNGEN UND SCHEIBEN
- English
- WIRELESS HIGH FREQUENCY TEST METHOD FOR INTEGRATED CIRCUITS AND DISCS
Classification
- CPC, 7
- G01R31/2884
- G01R31/2831
- G01R31/3025
- G01R31/303
- H01L22/34
- H01L2924/0002
- H01L2924/3011
- IPC, 3
- H01L21 66
- H01L21 822
- H01L27 04