AT301163T

Bimodal polyethylene composition and articles made therefrom

Abstract

The invention involves a bimodal molecular weight distribution of polyethylene compounds and its products, such as high maximum blow moulding products and transportation and distribution pipes. The combination has a low molecular weight (LMW) ethylene homopolymer component of a homogeneous and high molecular weight (HMW) ethylene copolymer composition, LMW are characterized by their molecular weight distribution MWDL below about 8. The combination is characterized by bimodal molecular weight distribution and the ductile-brittle transition temperature lower than-20 ° c Tdb. In some cases related to the implementation, the HMW components is characterized by "reverse comonomer distribution".

Term

No projected expiry on record.

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38 members in 12 offices

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Priority claims
DocumentOfficeKindDate
31335701United States of AmericaP
0226161United States of AmericaW

Members38

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CA2459552A1CanadaA1
WO03016362A1World Intellectual Property Organization (WIPO)A1
WO03016396A1World Intellectual Property Organization (WIPO)A1
US2003149180A1United States of AmericaA1
KR20040030139ARepublic of KoreaA
EP1417260A1European Patent Office (EPO)A1
MXPA04001496AMexicoA
US6787608B2United States of AmericaB2
BR0211959ABrazilA
US2004198911A1United States of AmericaA1
CN1543483AChinaA
JP2005500423AJapanA
WO03016362A9World Intellectual Property Organization (WIPO)A9
PL368611A1PolandA1
EP1417260B1European Patent Office (EPO)B1
AT301163TThis recordAustriaT
ATE301163T1AustriaT1
DE60205387D1GermanyD1
DE60205387T2GermanyT2
US7129296B2United States of AmericaB2
US2007021567A1United States of AmericaA1
CN1301292CChinaC
CN1982361AChinaA
US7345113B2United States of AmericaB2
US2008161497A1United States of AmericaA1
KR20080077284ARepublic of KoreaA
JP2009007579AJapanA
KR100902462B1Republic of KoreaB1
PL203864B1PolandB1
US7825190B2United States of AmericaB2
US2010317798A1United States of AmericaA1
CA2459552CCanadaC
CN1982361BChinaB
US8338538B2United States of AmericaB2
JP5153989B2JapanB2
US2013096266A1United States of AmericaA1
JP5198181B2JapanB2
US9006342B2United States of AmericaB2