Dual laser cutting of wafers

The method of cutting out a semiconductor wafer The 1st (302), The step which turns the 2nd (332) laser beams to the upper surface of the circuit board (100) ; A coating layer is crossed. It has a step from which the circuit board is cut with the 2nd laser beams along Step; which scans the 1st laser beams and forms the Sklar Eve line (102) of a coating layer, and the Sklar Eve line. This equipment contains the 1st laser with the 1st wavelength placed on the coating layer of the circuit board, and the 2nd laser (324) in which a wavelength has the 2nd wavelength that was placed on the surface of the circuit board unlike the 1st laser. The coating layer has the 1st absorption index to the wavelength of the 1st laser, and the semiconductor circuit board has the 2nd absorption index smaller than the 1st absorption index. The energy from the 1st laser beams is absorbed by the coating layer, the Sklar Eve line is formed, and the 2nd laser beams cut the circuit board along the Sklar Eve line.