Method for embedding a component in a base and forming a contact
Abstract
The publication claimed is a method, wherein a form a part of electronic transistor unit or at least multiple transistor unit terminal of the process of manufacturing a base and a base according to a circuit board. Thus, a structure is around the semiconductor device manufacturing or more not. To the invention, a transistor unit at least one conductive pattern and feeds is first line of the base. For semiconductor element arranged on the hole, aims at the conductive pattern. The transistor unit is connected with the base, and one or multiple conductive pattern layer and a base, so that the number of causing at least one conductive pattern and transistor unit of contact area of the electric contact.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
23 members in 13 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 20020190 | Finland | A | |
| 0300064 | Finland | W |
Members23
| Document | Office | Kind | |
|---|---|---|---|
| FI20020190A | Finland | A | |
| WO03065778A1 | World Intellectual Property Organization (WIPO) | A1 | |
| KR20040073606A | Republic of Korea | A | |
| EP1474959A1 | European Patent Office (EPO) | A1 | |
| BR0307364A | Brazil | A | |
| FI115285B | Finland | B | |
| EP1474959B1 | European Patent Office (EPO) | B1 | |
| AT295064TThis record | Austria | T | |
| ATE295064T1 | Austria | T1 | |
| CN1625927A | China | A | |
| DE60300619D1 | Germany | D1 | |
| JP2005517287A | Japan | A | |
| US2005124148A1 | United States of America | A1 | |
| RU2004126137A | Russian Federation | A | |
| DE60300619T2 | Germany | T2 | |
| US6991966B2 | United States of America | B2 | |
| HK1077151A1 | Hong Kong, China | A1 | |
| RU2297736C2 | Russian Federation | C2 | |
| IL163238A | Israel | A | |
| CN100566511C | China | C | |
| KR20100126546A | Republic of Korea | A | |
| KR101013325B1 | Republic of Korea | B1 | |
| BRPI0307364B1 | Brazil | B1 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Publication of translation of european patent specificationUEP | UEP |
Numbers
- Application
- 3700815
Titles2
- German
- VERFAHREN ZUM EINBETTEN EINER KOMPONENTE IN EINE BASIS UND ZUR BILDUNG EINES KONTAKTS
- English
- METHOD FOR EMBEDDING A COMPONENT INTO A BASIS AND FOR FORMING A CONTACT
Classification
- CPC, 26
- H05K1/185
- H01L23/5389
- H01L24/24
- H01L24/82
- H01L2224/24137
- H01L2224/24227
- H01L2224/82039
- H01L2224/92144
- H01L2924/01005
- H01L2924/01006
- H01L2924/01015
- H01L2924/01019
- H01L2924/01029
- H01L2924/01033
- H01L2924/01057
- H01L2924/01061
- H01L2924/01078
- H01L2924/01079
- H01L2924/01082
- H01L2924/014
- H01L2924/12042
- H01L2924/14
- H01L2924/15153
- H01L2924/1517
- H01L2924/181
- H01L2924/3025
- IPC, 7
- H01L21 56
- H01L21 60
- H01L23 538
- H01L25 04
- H01L25 18
- H05K1 00
- H05K1 18