Nova Patents
AT288948T

A polishing composition including an inhibitor of tungsten etching

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

40 members in 12 offices

This recordMember, by publication datePriority claim2 more offices are in the list below

Priority claims2

Priority claims
DocumentOfficeKindDate
90180397United States of AmericaA
8665998United States of AmericaA

Members40

Family members, oldest first
DocumentOfficeKind
WO9905706A1World Intellectual Property Organization (WIPO)A1
EP0896042A1European Patent Office (EPO)A1
AU8595498AAustraliaA
KR19990014245ARepublic of KoreaA
JPH11116948AJapanA
US6083419AUnited States of AmericaA
US6136711AUnited States of AmericaA
CN1272221AChinaA
IL134213D0IsraelD0
WO0202706A1World Intellectual Property Organization (WIPO)A1
AU7130801AAustraliaA
EP1299489A1European Patent Office (EPO)A1
US6592776B1United States of AmericaB1
CN1436225AChinaA
US2003203635A1United States of AmericaA1
MY116265AMalaysiaA
JP2004502823AJapanA
TW580514BTaiwan Province of ChinaB
US6767476B2United States of AmericaB2
EP0896042B1European Patent Office (EPO)B1
AT288948TThis recordAustriaT
ATE288948T1AustriaT1
DE69828925D1GermanyD1
DE69828925T2GermanyT2
CN1216953CChinaC
IL134213AIsraelA
TWI261063BTaiwan Province of ChinaB
KR100606315B1Republic of KoreaB1
EP1299489B1European Patent Office (EPO)B1
AT344830TAustriaT
ATE344830T1AustriaT1
DE60124404D1GermanyD1
CN1966594AChinaA
CN1326199CChinaC
DE60124404T2GermanyT2
JP4510374B2JapanB2
JP2012074734AJapanA
JP4917195B2JapanB2
CN1966594BChinaB
JP5571649B2JapanB2