Alkoxysilane/organic polymer composition for thin insulating film production and use thereof

A method of making and inner alkoxy silane/organic polymer composition, said composition comprising (A) a special alkoxy silane, (B) a special organic polymer, is used to said alkoxy silane (A) and (C) and organic polymer (B) solvent, the solvent comprises one having amide group and/or an ester of organic solvent; A silicon/organic polymer compound insulation film, wherein the insulation film is formed by the composition of the film, and dewatering and film alkoxy silane conducted wherein the alkoxysilane gel gelation gelling, and removing the residual solvent in the film; obtainingThe preparation method of wherein said composite film organic polymer and celluar silica film obtained by. The two of the film not only a low coefficient of dielectric constant and is suitable for a semiconductor element the insulating layer of multiple connecting, and can be in an appropriate the preparation method of use of semiconductor element manufacturing process.