A method for separating a film and a substrate

Method for separating a film (1) and a substrate (2) in which a sacrificial layer (7) between the film and the substrate is disposed, the method comprising the following steps: a) is provided on the film (1) a portion of at least one sheet (5), so that an adhesive contact between the film and the sheet occurs; b) being the sheet and the film in adhesive contact then bend outward from the substrate (2); c) the film (1) is separated uninterruptedly substrate (2), wherein the sacrificial layer (7) is partially separated at least during step c) with the aid of etching, thereby facilitating thus the separation of the film from the substrate, wherein at least a portion of the sheet (5) is attached to a circumferential surface of a roller (10) whose circumferential surface (14) touches almost the substrate (2) and wherein during step b) the substrate with the film, relative to the roller (10) to the roller feed, while the roller is rotated such that during step c) an increasing share of the film ( 1) is bent around the circumferential surface (14), while increasing part of the substrate (2) which has been separated takes the film, relative to the roller, away from the roller.