AT270463T

High laser absorption copper fuse and method for making the same

Abstract

A copper wire of high laser capable absorption to vanish the laser for conductor the lower part is at. The fuse moulded structure to form is connected with the copper wire according with small incident for energy. The metal circuit comprises a fuse wire connecting piece; the fuse connecting line are laminated in form at least two metal. The overlapping metal's bottom material of the conductive copper conductor, a cover rock metal is tungsten or titanium is tungsten composite material, wherein thickness and light selecting to make the bottom of the cover rock metal base and a metal to the incident infrared high energy absorption the. The is claimed providing cover material between the fuse wire or a selecting the fuse wire for manufacturing method.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

17 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims1

Priority claims
DocumentOfficeKindDate
30291599United States of AmericaA

Members17

Family members, oldest first
DocumentOfficeKind
EP1049164A1European Patent Office (EPO)A1
CN1272694AChinaA
JP2000323580AJapanA
KR20000071723ARepublic of KoreaA
TW455915BTaiwan Province of ChinaB
US6375159B2United States of AmericaB2
JP3300328B2JapanB2
SG90128A1SingaporeA1
KR100390691B1Republic of KoreaB1
EP1049164B1European Patent Office (EPO)B1
AT270463TThis recordAustriaT
ATE270463T1AustriaT1
DE60011837D1GermanyD1
ES2221602T3SpainT3
CN1183591CChinaC
DE60011837T2GermanyT2
MY127042AMalaysiaA