Process and apparatus for treating a workpiece such as a semiconductor wafer

The product introduced a novel chemical and utilizing technology, for processing related micro direct factory industry chemical treatment process for pollution. The related processing is: /Ion, and silica for drop to the organic material, particle and metal lowly. Generally speaking, cleaning for carrying semiconductor wafer and in a workpiece (20) punching method the workpiece surface of the chemical-liquid (20). The ozone or at the liquid processing flow channel (70), or at the processing environment (15). The form of a chemical flow of liquid or steam is exerted on a system the water; the system can control to form the workpiece surface (20) edge layer. The chemical and for simultaneously removing particle and organic material component (4b hydroxylamine), for increasing liquid the chemical substance of PH value, or is used for complete one or more specific cleaning tasks especially a chemical additives.