Low profile fan body with heat transfer characteristics

(-- 57) summary -- the electronic device cooling thin fan equipment (20) which has a suitable heat-conducting characteristic is indicated. The fan (22) stationed in a main part (20) has a fixed number of braids (30) formed in the circumference of a medial axis at the circumferencial direction. These braids (30) establish the direction braid depth domain of an axis in relation to a medial axis. This thin fan equipment (20) has a frame (25) which supports a fan (22). In the one case of the operation of the present invention, a heat transfer object (20) has the pressure difference side (34) formed the perimeter neighborhood of the fan blade (30) within the 1st portion of this direction braid depth domain of an axis. The interface side (38) for connecting with the electronic device concerned is located so that a fan frame (25) may be met. A fixed number of heat transfer means (45) are located between a frame (25) and an interface side (38) so that the heat transfer equipment (45) concerned may be located in the 2nd portion of the direction braid depth domain of an axis concerned. In other cases of the operation of the present invention, a heat transfer means (45) is arranged between a frame (25) and an interface side (38), without having a pressure difference side (34) along the whole direction braid depth domain of an axis. According to the form of the heat transfer means (45) concerned, these pieces of equipment becomes possible achieving the function of the both sides of a heating surface and a pressure difference side.