Nova Patents
AT193136T

Method and device for bonding a wire conductor

Abstract

The invention relates to the manufacturing with the coil (12) and a chip unit (15) and when a substrate (11) module matched and method and device of wire (13) and a contact. Transition on wire on the first working platform and storage chip unit joint surface (18) and (19) or wherein the joint surface section, and fixed to a joint surface (18) and (19) related substrate (11) is or and connection of related; a(25) By connecting device and 37) (13) and (18) and (19) is fixedly to the joint surface of the second work platform.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

27 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims4

Priority claims
DocumentOfficeKindDate
19604840GermanyA
19619771GermanyA
19620242GermanyA
9700261GermanyW

Members27

Family members, oldest first
DocumentOfficeKind
DE19619771A1GermanyA1
CA2245775A1CanadaA1
CA2449413A1CanadaA1
WO9730418A2World Intellectual Property Organization (WIPO)A2
AU2846397AAustraliaA
WO9730418A3World Intellectual Property Organization (WIPO)A3
DE19620242A1GermanyA1
EP0880754A2European Patent Office (EPO)A2
CN1210602AChinaA
AU709049B2AustraliaB2
DE19620242C2GermanyC2
KR19990082483ARepublic of KoreaA
JP2000502477AJapanA
EP0880754B1European Patent Office (EPO)B1
AT193136TThis recordAustriaT
ATE193136T1AustriaT1
DE59701709D1GermanyD1
ES2146989T3SpainT3
US6233818B1United States of AmericaB1
US2001054230A1United States of AmericaA1
KR100373063B1Republic of KoreaB1
CN1119768CChinaC
US6698089B2United States of AmericaB2
CA2245775CCanadaC
CA2449413CCanadaC
JP3721520B2JapanB2
DE59701709C5GermanyC5