AT184730T
High density, three-dimensional, intercoupled circuit structure
Abstract
This record has no abstract on file.
Term
No projected expiry on record.
- Priority
- Filed
- Granted
- Today
58 members in 6 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 87133692 | United States of America | A |
Members58
| Document | Office | Kind | |
|---|---|---|---|
| US5106455A | United States of America | A | |
| CA2059345A1 | Canada | A1 | |
| EP0497227A2 | European Patent Office (EPO) | A2 | |
| EP0497227A3 | European Patent Office (EPO) | A3 | |
| CA2094234A1 | Canada | A1 | |
| EP0571756A2 | European Patent Office (EPO) | A2 | |
| CA2097668A1 | Canada | A1 | |
| US5269882A | United States of America | A | |
| US5270485A | United States of America | A | |
| EP0574022A2 | European Patent Office (EPO) | A2 | |
| CA2097404A1 | Canada | A1 | |
| EP0574861A1 | European Patent Office (EPO) | A1 | |
| US5273622A | United States of America | A | |
| EP0574022A3 | European Patent Office (EPO) | A3 | |
| JPH06134586A | Japan | A | |
| EP0571756A3 | European Patent Office (EPO) | A3 | |
| JPH06224111A | Japan | A | |
| JPH06342991A | Japan | A | |
| JPH077975A | Japan | A | |
| US5451774A | United States of America | A | |
| US5481184A | United States of America | A | |
| EP0574861B1 | European Patent Office (EPO) | B1 | |
| AT133812T | Austria | T | |
| DE69301433D1 | Germany | D1 | |
| DE69301433T2 | Germany | T2 | |
| US5594330A | United States of America | A | |
| US5610747A | United States of America | A | |
| EP0497227B1 | European Patent Office (EPO) | B1 | |
| AT151914T | Austria | T | |
| DE69218983D1 | Germany | D1 | |
| US5634194A | United States of America | A | |
| DE69218983T2 | Germany | T2 | |
| US5673131A | United States of America | A | |
| EP0833163A1 | European Patent Office (EPO) | A1 | |
| US5744947A | United States of America | A | |
| US5747692A | United States of America | A | |
| US5747993A | United States of America | A | |
| US5767824A | United States of America | A | |
| US5769389A | United States of America | A | |
| EP0574022B1 | European Patent Office (EPO) | B1 | |
| AT170662T | Austria | T | |
| DE69320699D1 | Germany | D1 | |
| CA2059345C | Canada | C | |
| DE69320699T2 | Germany | T2 | |
| US5933002A | United States of America | A | |
| EP0571756B1 | European Patent Office (EPO) | B1 | |
| AT184730TThis record | Austria | T | |
| DE69326381D1 | Germany | D1 | |
| DE69326381T2 | Germany | T2 | |
| CA2097668C | Canada | C | |
| JP3217832B2 | Japan | B2 | |
| US6531861B1 | United States of America | B1 | |
| US2003222635A1 | United States of America | A1 | |
| US2004221658A1 | United States of America | A1 | |
| CA2094234C | Canada | C | |
| US6933715B2 | United States of America | B2 | |
| US6992474B2 | United States of America | B2 | |
| JP3824329B2 | Japan | B2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 93106388
Titles2
- German
- INNERLICH VERBUNDENE DREIDIMENSIONELLE SCHALTUNGSSTRUKTUR HÖHERER DICHTE
- English
- INTERNALLY CONNECTED THREE DIMENSIONAL CIRCUIT STRUCTURE OF HIGHER DENSITY
Classification
- CPC, 31
- B23K15/002
- B23K17/00
- B23K26/08
- G01P15/08
- G01P15/0922
- G01P15/18
- G02B6/12002
- G02B6/4295
- G02B6/43
- G03C7/24
- G03F7/70691
- G05B19/186
- G09F9/33
- G12B1/00
- H01L21/4846
- H01L21/67011
- H01L21/68
- H01L23/13
- H01L23/473
- H01L23/5385
- H01L23/642
- H01L25/065
- H01L25/105
- H01L25/162
- H01L29/0657
- H01L2225/1005
- H01L2225/1023
- H01L2225/1064
- H01L2225/1076
- H01L2225/1082
- H01L2924/0002
- IPC, 28
- B23K15 00
- B23K17 00
- B23K26 08
- G01P15 08
- G01P15 09
- G01P15 18
- G02B6 12
- G02B6 42
- G02B6 43
- G03C7 24
- G03F7 20
- G05B19 18
- G09F9 33
- G12B1 00
- H01L21 00
- H01L21 48
- H01L21 68
- H01L23 13
- H01L23 473
- H01L23 538
- H01L23 64
- H01L25 065
- H01L25 10
- H01L25 16
- H01L29 06
- H01L41 09
- H05K1 02
- H05K7 20