AT13697T

Process for the preparation of an additive for an acid bath for the electrodeposition of copper and use thereof.

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

13 members in 9 offices

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8114394FranceA

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IE821754LIrelandL
FR2510145A1FranceA1
EP0071512A1European Patent Office (EPO)A1
JPS5827992AJapanA
US4430173AUnited States of AmericaA
EP0071512B1European Patent Office (EPO)B1
AT13697TThis recordAustriaT
DE3264038D1GermanyD1
FR2510145B1FranceB1
JPS6155599B2JapanB2
HK96586AHong Kong, ChinaA
SG64086GSingaporeG
IE53352B1IrelandB1